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The Society for Science & the Public announced today that we are seeking a new title sponsor for the nearly 70-year-old International Science and Engineering Fair (ISEF), the world’s largest international high school STEM (science, technology, engineering and mathematics) competition.
The title sponsorship of this event is now available for only the second time in its storied history. Intel has served as the title sponsor since 1997, but will not be renewing. A new sponsor will assume the sole title sponsorship in May 2019.
Each year, millions of high school students from around the globe enter this most powerful STEM talent pipeline. These students – tomorrow’s leading scientists, engineers, innovators and entrepreneurs – strive to discover answers and develop new solutions to humanity’s greatest problems.
“We are at an inflection point. Our next sponsor has an extraordinary opportunity to inspire and impact future generations of scientific leaders, innovators and entrepreneurs,” said Maya Ajmera, President and CEO of Society for Science & the Public and Publisher of Science News. “This competition and its affiliated science fairs held across the globe reach young people like no other program can, igniting their passion for science and their desire to discover innovative solutions to some of our world’s most intractable problems.”
The International Science and Engineering Fair presents an extraordinary opportunity for the next sponsor to inspire, connect with and directly support top high school students in their local communities and on a global stage.
The annual program and competition celebrates tomorrow’s leaders, innovators and entrepreneurs — while presenting the title sponsor the opportunity to inspire, connect with and directly support an unparalleled talent pipeline and alumni community on a global stage. In its nearly 70 years, the International Science and Engineering Fair has yielded thousands of distinguished alumni, including top innovators and entrepreneurs as well as recipients of the world’s most coveted science and math honors such as the Nobel Prize, National Medal of Science, Breakthrough Prize, and MacArthur Fellowship.
“Sponsorship of the International Science and Engineering Fair spans global borders, providing an invaluable platform that ensures we can identify and develop the next generations of top young scientists, engineers and innovators,” said Craig Barrett, former CEO and Chairman of the Board of Intel Corporation and current Society Trustee. “These young people make the world a better place for all of us.”
For more information about sponsorship and to view the RPF, please visit here: https://www.societyforscience.org/future-isef
Matt Fichtenbaum (Intel ISEF 1962, Westinghouse STS 1962) has eclectic interests, ranging from art to science.
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